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Nikon SLM Solutions and Wipro 3D Announce Strategic Partnership to Accelerate Additive Manufacturing in India

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Nikon SLM Solutions, a global leader in metal additive manufacturing, and Wipro 3D, a pioneer in additive manufacturing solutions, are excited to announce a strategic partnership to accelerate the adoption of advanced 3D printing technologies in India. This collaboration aims to leverage Wipro 3D’s extensive infrastructure and technical expertise to provide superior quality additive manufacturing services across various sectors.

The partnership will see the distribution of cutting-edge metal 3D printing machines from Nikon SLM Solutions in the Indian market. By combining Nikon’s pioneering multi-laser technology with Wipro 3D’s rich experience in implementing 3D printing solutions, the collaboration aims to address the evolving demands of industries such as aerospace, automotive, healthcare, marine, oil & gas, and heavy engineering.

Pratik Kumar, CEO, Wipro Infrastructure Engineering (WIN) & Managing Director, Wipro Enterprises said, “We are very pleased to embark on this strategic partnership between Wipro 3D and Nikon SLM Solutions, which underscores our commitment to driving innovation and excellence in Additive Manufacturing in India. By combining our strengths, we aim to advance industrial manufacturing and contribute significantly to the nation’s quest for self-reliance and technological advancement.”

“We are thrilled to partner with Wipro 3D to bring our advanced additive manufacturing technologies to the Indian market. This collaboration is a testament to our commitment to innovation and our vision of driving the future of manufacturing. By combining our expertise with Wipro 3D’s deep understanding of the local market, we aim to provide unparalleled value to our customers and contribute to the growth of additive manufacturing in India. We are excited about the opportunities this partnership brings and look forward to a successful journey together,” added Sam O’Leary, CEO of Nikon SLM Solutions.

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