DN Solutions Launches DNC Series for Precision Semiconductor Grinding

DN Solutions has unveiled its new DNC Series, comprising the DNC 8050 and DNC 8060, a line of high-precision grinding machines developed specifically for the semiconductor industry.

The name ‘DNC’ stands for DN Solutions Ceramic, representing the company’s ceramic machining equipment. These machines are designed to manufacture consumable components such as focus rings used in the semiconductor wafer process. Since these parts operate inside chambers that endure high temperatures and exposure to chemicals, they are made from materials like quartz, ceramic, and silicon carbide (SiC) — all of which are notoriously hard to machine. The DNC Series enables precise grinding of these hard-to-cut materials.

Precision Machining of Quartz and Ceramics Powered by DN Solutions’ Technology

Quartz is harder than carbon steel yet brittle and prone to fracture, making it challenging to machine with conventional tools. Even with costly diamond tools, micro-cracks and breakage often occur. Moreover, quartz is sensitive to impurities, demanding an exceptionally clean machining environment.

To address these challenges, DN Solutions developed a high-performance grinding spindle for the DNC Series, capable of 10,000 rpm and 7.5 kW output. This spindle delivers both high productivity and precision even when machining difficult materials such as quartz and ceramics.

Vibration- and heat-induced errors have also been minimized. The monolithic, high-rigidity bed and high-precision feed-axis guides suppress vibration and prevent thermal displacement during long continuous operations. While conventional machines tend to lose precision due to spindle drift, the DNC Series ensures long-term accuracy and structural rigidity, extending equipment lifespan significantly.

Clean Solutions for Quartz Dust and Tool Dressing Challenges

Fine quartz dust (sludge) produced during machining can cause serious equipment failure. To prevent this, DN Solutions adopted a fully enclosed sliding cover that shields the inclined bed surface, blocking coolant and dust from entering the machine interior. A straight, detachable coolant tank also simplifies sludge cleaning and maintenance.

The DNC Series further improves efficiency through an internal spindle dedicated to automatic tool dressing. In grinding, the wheel’s surface inevitably clogs with debris, requiring periodic dressing to restore shape and cutting performance. Traditional equipment typically needed to halt operations for this process; the DNC Series performs it automatically and seamlessly.

Moreover, the DNC Series combines the multi-functionality of a machining center (milling) with the capabilities of a turning center (lathe), allowing inner and outer diameter, hole, and contour machining in a single setup. It is also equipped with an Automatic Tool Changer (ATC), Automatic Tool Measuring Device, and Automatic Workpiece Measuring Device, enabling fully automated operation, reducing operator workload, and enhancing productivity.

A DN Solutions official stated, that, “DN Solutions already holds around 50% of the South Korean semiconductor material machining equipment market, and nearly 80% in some processes. The DNC Series builds on our deep expertise and field experience, and will play a crucial role in enhancing manufacturing competitiveness and technological capabilities for customers around the world.” 

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